atect Corporation manufactures and markets spacer tapes (Note 5) , which protect the tape components, including TAB (Note 3) tapes and COF (Note 4) tapes, used for implementing the parts for electronic communication devices, such as the LSI chips for driving LCD panels and plasma display panels (Note 1) and the LSI chips for IC cards (Note 2) . Basically, we sell our products directly to electronic components manufacturers. However, we also sell our products to overseas companies mainly located in Asia through a trading company.
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| Spacer tapes |
Emboss spacer tapes |
Leader tapes |
| ■Glossary |
| Note 1:
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“The LSI chips for driving liquid-crystal display (LCD) panels and plasma display panels.” The LSI chips adapted to liquid-crystal display (LCD) panels drive them and display data by converting it into voltage, whereas the LSI chips adapted to plasma display panels control each of the picture elements or pixels located all over the display panels to produce vivid colors and fine brightness. |
| Note 2: |
“The LSI chips for IC cards” refer to the application specified LSI chips integrating data memories, CPUs, contactless communication circuits, cryptographic circuits etc. |
| Note 3: | “TAB” is the acronym of tape automated bonding referring to the method allowing tape films to be used as LSI implementation boards, which are mainly adopted to large-size LCD and PDP panels, and middle- and small-size LCD panels for cellular phones, PDAs, car navigators etc. Also, they are adopted to interposers for ball grid arrays (BGAs) including memories and digital signal processors (DSP). |
| Note 4: | “COF” is the acronym of chip on FPC referring to the technology used to carry out the flip-chip implementation of semiconductor LSI chips into flexible printed circuit boards. This technology was developed to replace TAB for implementation into large-size LCD panels. |
| Note 5:
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“Spacer tapes” include emboss spacer tapes which prevent the products rolled around reels during the TAB or COF manufacturing and forwarding process from rubbing against each other, mold spacer tapes, flat tapes, and leader tapes used as leaders (drawing parts) during the TAB or COF manufacturing process. |
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